ACTSPRAY is a manufacturer of precision cleaning equipment – for SMT, PCBA & Semiconductor Applications

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Advance Spray Cleaning Tech for Superior Flux Removal

We help customers achieve higher cleanliness, reliability, and production efficiency.

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About Our Business

Our Core Business Division

ACTSPRAY takes technological innovation as the driving force to provide advanced cleaning equipment for SMT, PCBA, and semiconductor package applications, delivering superior performance, high production efficiency, and cost‑effectiveness for customers and the market—unlocking new possibilities for next‑generation electronics manufacturing.

About us

Who We Are

ACTSPRAY CLEAN

ACTSPRAY delivering the most stable performance cleaning equipment across a wide range of industries: electronics, semiconductor, automotive, medical devices, aerospace, AI / Server (CPO) and more.Headquartered in Dongguan, China and certified to ISO9001, features a decade-experienced R&D team for fast custom orders and dependable delivery, paired with full-lifecycle technical support and after-sales service for semiconductor & PCB assembly cleaning applications.

What We Sell

Featured Products

We offer a range of standard & customized cleaning equipment for PCB, SMT & Semiconductor industries to fully meet varied production needs.

AC530 Batch PCBA Cleaning Machine SMT Offline Cleaner for Small Volume PCB Assembly Laboratory Flux Residual Removal

PCBA Cleaning, Batch

The AC530 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.

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BC320 Electric SMT Stencil Cleaner Automatic Solder Paste Stencil Cleaning Machine

SMT Cleaning, Stencil Cleaner

The BC320 electric SMT stencil cleaning machine uses a three‑stage process—spray cleaning, DI water rinsing, and hot‑air drying—to clean solder paste stencils, red glue stencils, and misprinted PCBs with high precision. Fully automated, water‑based, and built with SUS304 stainless steel.

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BC210 Fixture Cleaning Machine for wave soldering fixtures and reflow oven condensers

Coating Pallet Fixture Cleaning Machine for SMT Production Line Maintenance BC210

SMT Cleaning, Pallet Cleaner

BC210 Coating Pallet Cleaning Machine for wave soldering fixtures, reflow oven condensers, claws, chains and PCBA tooling. Water‑based chemcial liquid cleaning, full‑coverage spray, tape water or DI water rinse and hot‑air drying in one chamber. High efficiency, safe operation and long service life.

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DI200 DI Water Generator Automatic Deionized Water Purifier with RO System for PCBA Cleaning Production 200L/H

Auxiliary Equipment, DI Water Generator

DI200 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.

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FC610 BGA Inline Aqueous Cleaning Machine for Solder Ball Mount Flux Removal

FC610 BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine

Semiconductor, Advanced Packaging

The FC610 Inline Cleaning System is an automated solution engineered specifically for the removal of water‑soluble flux residues after the BGA solder ball mounting process. Designed for high‑reliability semiconductor packaging, the FC610 has double layer kevlay mesh to ensures consistent, stable and thorough cleaning.It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, hot air-knife air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.

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FC760 Inline Deflux Cleaning Machine for Semiconductor Packaging & PCBA High Volume Production

Semiconductor, Advanced Packaging

The FC760 Inline Cleaning System is engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC760 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.

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GC860 SIP Inline Zero Wastewater Cleaning Machine | Flux Cleaning System

GC860 Zero-Wastewater Inline Deflux Cleaning Machine for Advanced Modules and Semiconductor Packages

Semiconductor, Zero-Wastewater

The GC860 is a zero-wastewater inline cleaning system designed for post-soldering flux removal from SiP modules, FCBGA packages, optical modules and other precision electronic products.SIP Flux Cleaning | Zero Rinse Wastewater | Closed-Loop Liquid Recovery | Condensation Recovery | Multi-Stage Spray Cleaning | Hot Air Drying | SMEMA | Optional MES

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FC820 SiP Inline Cleaning Machine for Semiconductor Packaging Automatic PCB Cleaner

Advanced packaging cleaning machine for fcBGA SiP and chiplet semiconductor manufacturing

SiP Inline Cleaning Machine for Semiconductor Packaging Automatic PCB Cleaner FC820

Semiconductor, Advanced Packaging

FC820 is an automatic aqueous cleaning machine dedicated to remove flux from large-size and low-standoff gap SiP packaging modules and high-capacity PCBAs. As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures. Typical cleaning challenges include: - Flux trapped under ultra-low standoff gap; - Incomplete cleaning under FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and 2.5D/3D packages; - Ionic contamination affecting reliability; - Cleaning consistency in high-volume inline production.The FC820 inline cleaning euipment is specifically engineered to solve these advanced packaging cleaning challenges.

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Our Strengths

Why Choose us?

Cleanliness is critical to semiconductor reliability and advanced electronic manufacturing. ACTSPRAY delivers high-performance cleaning solutions designed for today’s complex packaging technologies and precision assemblies.

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Advanced Cleaning Technology

We supply high-performance inline cleaning and drying systems to deliver exceptional cleaning results, stable running processes and consistent production quality. Our customized precision cleaning equipment are tailored for PCB assembly and advanced semiconductor packaging scenarios, covering SiP, Flip Chip, FCBGA, FCCSP, 2.5D/3D chips, low-standoff components, etc.

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Custom Solution

We provide both standard cleaning equipment and fully customized cleaning solutions to meet a wide range of production requirements. Our factory is ISO 9001 certified, and most equipment complies with CE standards, ensuring consistent quality, safety, and reliability for global industrial applications.

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Rich Experience & Global Service

We have extensive industry experience and provide comprehensive global after-sales support across the full product lifecycle, ensuring reliable service worldwide. Our professional team delivers rapid response, strong technical expertise, and end-to-end assistance, with established installed bases in India, Thailand, Vietnam, and the United States supported by local agents for timely on-site service.

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